IMC AND CREEP BEHAVIOR IN LEAD-FREE SOLDER JOINTS OF Sn-Ag AND Sn-Ag-Cu ALLOY SYSTEM BY SP METHOD

YANG, Z. J.; YANG, S. M.; YU, H. S.; KANG, S. J.; SONG, J. H.; KIM, K. J.

doi:2014.15.7.1137

International Journal of Automotive Technology > Volume 15(7); 2014 > Article

Materials and Recycling, Manufacturing

International Journal of Automotive Technology 2014;15(7): 1137-1142.
doi: https://doi.org/10.1007/s12239-014-0118-3

IMC AND CREEP BEHAVIOR IN LEAD-FREE SOLDER JOINTS OF Sn-Ag AND Sn-Ag-Cu ALLOY SYSTEM BY SP METHOD

Z. J. YANG¹, S. M. YANG¹, H. S. YU¹, S. J. KANG², J. H. SONG³, K. J. KIM⁴

¹Chonbuk National University
²Jeonju Institute of Machinery and Carbon composite
³Korea Institute of Carbon Convergence Technology
⁴JMC (Jeonju Institute of Machinery and Carbon comp

ABSTRACT

The creep properties of Lead-free solder joints were evaluated by Shear Punch (SP) method. Lead-free solder joints with Sn-4Ag, Sn-4Ag-0.5Cu and Sn-4Ag-1.0Cu solder tested and compared to the lead solder joint with Sn-37Pb. SP creep tests were performed at temperature of 30, 50 and 80oC. For the SP method, constant shear stresses from 3 to 22 MPa were applied into the SP specimen(10

Key Words: Sn-Ag and Sn-Ag-Cu alloy, Creep behavior, SP method, IMC, Activation energy, Power law relationships