PublisherDOIYearVolumeIssuePageTitleAuthor(s)Link
International Journal of Automotive Technology10.1007/s12239-022-0151-620222361739-1745Development of Crash Pad Using Overmolding TechnologyDong Kyou Park, Byung Seok Kong, Byung Chul Kimhttps://link.springer.com/content/pdf/10.1007/s12239-022-0151-6.pdf, https://link.springer.com/article/10.1007/s12239-022-0151-6/fulltext.html, https://link.springer.com/content/pdf/10.1007/s12239-022-0151-6.pdf
JSAE Review10.1016/0389-4304(95)95083-71995163317Solvent-free adhesive technology for vacuum forming of instrument crash padT Odahttps://api.elsevier.com/content/article/PII:0389-4304(95)95083-7?httpAccept=text/xml, https://api.elsevier.com/content/article/PII:0389-4304(95)95083-7?httpAccept=text/plain
Pigment & Resin Technology10.1108/prt.2009.12938aad.0142009381Success with overmolding technology: marrying soft TPEs with hard substrateshttps://www.emerald.com/insight/content/doi/10.1108/prt.2009.12938aad.014/full/xml, https://www.emerald.com/insight/content/doi/10.1108/prt.2009.12938aad.014/full/html
Plastics Engineering10.1002/peng.20005201874816-21Composites Overmolding Expanding OpportunitiesPeggy Malnatihttps://api.wiley.com/onlinelibrary/tdm/v1/articles/10.1002%2Fpeng.20005, http://onlinelibrary.wiley.com/wol1/doi/10.1002/peng.20005/fullpdf
2019 42nd International Spring Seminar on Electronics Technology (ISSE)10.1109/isse.2019.88102642019Reliability of Molded Interconnect Devices Regarding Crack Initiation and OvermoldingPhilipp Braeuer, Thomas Kuhn, Martin Mueller, Joerg Frankehttp://xplorestaging.ieee.org/ielx7/8791838/8810148/08810264.pdf?arnumber=8810264
Microwave and Optical Technology Letters10.1002/mop.27153201254112606-2610Pad-to-pad isolation of vertical interconnects using magnetically aligned anisotropic conductive adhesiveSungwook Moonhttps://api.wiley.com/onlinelibrary/tdm/v1/articles/10.1002%2Fmop.27153, https://onlinelibrary.wiley.com/doi/full/10.1002/mop.27153
International Journal of Clothing Science and Technology10.1108/ijcst-09-2018-01162019322271-283Design and development of feminine reusable pad without pad holderSufiyan Derbew Tikuhttps://www.emerald.com/insight/content/doi/10.1108/IJCST-09-2018-0116/full/xml, https://www.emerald.com/insight/content/doi/10.1108/IJCST-09-2018-0116/full/html
2022 13th National Conference with International Participation (ELECTRONICA)10.1109/electronica55578.2022.98743962022Automatic Preparation of Contact Packages for Overmolding Using RobotsValentin Tsenevhttp://xplorestaging.ieee.org/ielx7/9874381/9874359/09874396.pdf?arnumber=9874396
Plastics Engineering10.1002/j.1941-9635.2017.tb01709.x201773524-27Overmolding Continues to Grow & Find Creative New ApplicationsJennifer Markarianhttps://api.wiley.com/onlinelibrary/tdm/v1/articles/10.1002%2Fj.1941-9635.2017.tb01709.x, http://onlinelibrary.wiley.com/wol1/doi/10.1002/j.1941-9635.2017.tb01709.x/fullpdf
IEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/tcpmt.2020.29695122020103479-486Fabrication of a Shear Stress Sensor Matrix Using Standard Printed Circuit Board and Overmolding TechnologiesAnn Monte, Jef Daems, Jeroen Missinnehttp://xplorestaging.ieee.org/ielx7/5503870/9031566/08970323.pdf?arnumber=8970323