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Dong Kyou Park , Byung Seok Kong , Byung Chul Kim
International Journal of Automotive Technology. 2022;23(6):1739-1745.     DOI:

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Development of Crash Pad Using Overmolding Technology
International Journal of Automotive Technology. 2022;23(6):1739-1745   Crossref logo
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Solvent-free adhesive technology for vacuum forming of instrument crash pad
JSAE Review. 1995;16(3):317   Crossref logo
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Success with overmolding technology: marrying soft TPEs with hard substrates
Pigment & Resin Technology. 2009;38(1):   Crossref logo
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Composites Overmolding Expanding Opportunities
Plastics Engineering. 2018;74(8):16-21   Crossref logo
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Reliability of Molded Interconnect Devices Regarding Crack Initiation and Overmolding
2019 42nd International Spring Seminar on Electronics Technology (ISSE). 2019;   Crossref logo

Pad-to-pad isolation of vertical interconnects using magnetically aligned anisotropic conductive adhesive
Microwave and Optical Technology Letters. 2012;54(11):2606-2610   Crossref logo
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Automatic Preparation of Contact Packages for Overmolding Using Robots
2022 13th National Conference with International Participation (ELECTRONICA). 2022;   Crossref logo

Design and development of feminine reusable pad without pad holder
International Journal of Clothing Science and Technology. 2019;32(2):271-283   Crossref logo
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Overmolding Continues to Grow & Find Creative New Applications
Plastics Engineering. 2017;73(5):24-27   Crossref logo
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Design of a compact, high speed optical transceiver using two step overmolding
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 1996;19(3):562-568   Crossref logo

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