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DEVELOPMENT OF CRASH PAD USING OVERMOLDING TECHNOLOGY |
Dong Kyou Park , Byung Seok Kong , Byung Chul Kim |
International Journal of Automotive Technology. 2022;23(6):1739-1745. DOI: https://doi.org/10.1007/s12239-022-0151-6 |
Development of Crash Pad Using Overmolding Technology Solvent-free adhesive technology for vacuum forming of instrument crash pad Success with overmolding technology: marrying soft TPEs with hard substrates Composites Overmolding Expanding Opportunities Reliability of Molded Interconnect Devices Regarding Crack Initiation and Overmolding Pad-to-pad isolation of vertical interconnects using magnetically aligned anisotropic conductive adhesive Automatic Preparation of Contact Packages for Overmolding Using Robots Design and development of feminine reusable pad without pad holder Overmolding Continues to Grow & Find Creative New Applications Design of a compact, high speed optical transceiver using two step overmolding IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 1996;19(3):562-568 |
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