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Author :
Z. J. YANG 1 Article
 Materials and Recycling, Manufacturing
1137 IMC AND CREEP BEHAVIOR IN LEAD-FREE SOLDER JOINTS OF Sn-Ag AND Sn-Ag-Cu ALLOY SYSTEM BY SP METHOD
Z. J. YANG, S. M. YANG, H. S. YU, S. J. KANG, J. H. SONG, K. J. KIM
Int J Automot Technol. 2014;15(7):1137-1142.    DOI: https://doi.org/10.1007/s12239-014-0118-3
         Cited By 12
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